Techncial Info
Welcome to the HD MicroSystems™ technical information library.
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Technical Papers from the Symposium on Polymers
- HD4004 PSPI Manufacturing, Integration and CPI Qualification by R. Volant, IBM
- Evaluation of HD4004 Photosensitive Polyimide for Semiconductor Applications by T. Daubenspeck, IBM
- Integration of a High Tg PSPI, HD4004, for 300mm Wafer Finishing for all Package Types by K. Larson, IBM
- Design and Material Integration for an Advanced Wafer-Level Chip Scale Package by G. Rhine, Unitive
- HD-4000 Profile Optimization Through Process Enhancement by S. Dunn, HD MicroSystems
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Other Technical Papers
- Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing to Avoid Thin Wafer Handling
- IEIEC Article on Moisture Resistance of Polyimide and BCB
- Advanced Packaging Article Introducing HD-4000 Series
- Solid State Technologies Article on Delphi Automotive Applications
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Technical Bulletins
- Product Selector Guide
- Shelf Life
- Packaging and Shipping
- Technical Service Facility
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Product Bulletins
| Photodefineable | Non-photodefinable | Ancillary Products |
HD-4100 Series
HD-8820
HD-8930 | PI-2525, PI-2555 & PI-2574
PI-2545
PI-2600 Series
PI-5878G
HD-3007 | PA-400 Series
T-9038
VM-651
VM-652 |
Material Safety Data Sheets
| Photodefineable | Non-photodefinable | Ancillary Products |
HD-4004
HD-4100
HD-4104
HD-4110
HD-8820
HD-8921 | PI-2525
PI-2545
PI-2555
PI-2574
PI-2610
PI-2611
PI-5878G
HD-3007 | PA-400D
PA-400R
PA-410D
T-9038
VM-651
VM-652 |
To download one of the documents above, you must complete a short one-time registration form. Once you have completed the registration you will arrive at our document library.
|
If you can't find what you're looking for here, please either submit a
technical question or
contact a local regional representative.
