Application Areas
	Stress Buffer Passivation Layers HD-4001, photo definable PI-2771, photo definable PIX Series, wet etch PI-2545/PI5878G, wet etch Flip Chip, C-4 & Bond Pad Re-distribution HD-4000, photo definable PI-5878G Series, wet etch PI-2731 photo definable PI-2727 photo definable Semiconductor Interlayer Dielectric HD-4000/HD-4010, photo definable PI-2730 Series, photo definable PI-2600 Series, dry etch PI-2545 Series, wet etch PI-2556/2555 Series, dry etch MCM-D & Packaging Interlayer Dielectric HD-4000 Series PI-2730 Series, photo definable PI-2600 Series, dry etch PI-2525, dry etch High Planarity and Gap Fill PI-2560 PI-2562, dry etch PIX-6400, dry etch Polyimide Die Coat PI-2579B, rapid curing Optic Fiber & Quartz Capillary Coatings PI-2525, rapid curing PI-2615/PIX-L110SX, high temp/low moisture
	Application Areas Home Page | Products |Technical Information | HDM News and Communications | Connect to HDM | Hot Links