Product Applications
	Polyimides are high temperature engineering polymers with excellent mechanical, thermal, and electrical properties. Microelectronic applications include stress buffer, passivation layer, chip bonding, and interlayer dielectric. Polyimides are typically applied in liquid form, then thermally cured into a film or layer with the desired properties. For most products, the film can be patterned using photographic processes. Following is a listing of HD Microsystems products on three seperate pages based on application, process route and cured film properties. A review of all three pages should help facilitate selection of the right product for a given application.
	Application Areas Process Route and Film Thickness Cured Film Properties You can click here to download a .pdf* file to keep for your reference. * This is an 8 MB file which may take some time to download over telephone lines
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