Thank you to everyone who attended our presentation at IMAPS 2026 in Boston.
We shared our latest study on "Low-Shrinkage Photosensitive Polyimide for CMP-free Multilayer RDL Fabrication Process" and appreciated the valuable discussions with attendees.
View Abstract : Low-Shrinkage Photosensitive Polyimide for CMP-free Multilayer RDL Fabrication Process
We look forward to continuing these conversations and exploring how our material innovations can help enable the next generation of semiconductor packaging.