Technical Info

 
 
 

Welcome to the HD MicroSystems™ Technical Information Library

To download one of the documents below, you must complete a short one-time registration form. Once you have completed the registration you will arrive at our document library.

If you can't find what you're looking for here, please either submit a technical question or contact a local regional representative.

 
 
 

Complete our short registration form to access our technical library.
Go directly to our technical library to download our product bulletins and data sheets.
 
 
 

Technical Papers from the Symposium on Polymers

  • HD4004 PSPI Manufacturing, Integration and CPI Qualification by R. Volant, IBM
  • Evaluation of HD4004 Photosensitive Polyimide for Semiconductor Applications by T. Daubenspeck, IBM
  • Integration of a High Tg PSPI, HD4004, for 300mm Wafer Finishing for all Package Types by K. Larson, IBM
  • Design and Material Integration for an Advanced Wafer-Level Chip Scale Package by G. Rhine, Unitive
  • HD-4000 Profile Optimization Through Process Enhancement by S. Dunn, HD MicroSystems

Other Technical Papers

  • Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing to Avoid Thin Wafer Handling
  • IEIEC Article on Moisture Resistance of Polyimide and BCB
  • Advanced Packaging Article Introducing HD-4000 Series
  • Solid State Technologies Article on Delphi Automotive Applications

Technical Bulletins

  • Product Selector Guide
  • Shelf Life
  • Packaging and Shipping
  • Technical Service Facility