Welcome to the HD MicroSystems™ Technical Information Library

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Technical Papers from the Symposium on Polymers

• HD4004 PSPI Manufacturing, Integration and CPI Qualification by R. Volant, IBM
• Evaluation of HD4004 Photosensitive Polyimide for Semiconductor Applications by T. Daubenspeck, IBM
• Integration of a High Tg PSPI, HD4004, for 300mm Wafer Finishing for all Package Types by K. Larson, IBM
• Design and Material Integration for an Advanced Wafer-Level Chip Scale Package by G. Rhine, Unitive
• HD4000 Profile Optimization Through Process Enhancement by S. Dunn, HD MicroSystems

Other Technical Papers

• Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing to Avoid Thin Wafer Handling
• IEIEC Article on Moisture Resistance of Polyimide and BCB
• Advanced Packaging Article Introducing HD4000 Series
• Solid State Technologies Article on Delphi Automotive Applications

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