25th anniversary Ceremony was held for the 25th anniversary of foundation.
Relocation of HDMJ Headquarters HD MicroSystems, Ltd. (HDMJ) Headquarters was relocated from Iidabashi to Shinjuku.
Release of HD7000 series Low-temperature curable solvent developable photosensitive PI was developed.
Change of company name Company name was changed to HD MicroSystems, Ltd.
20th anniversary Ceremony was held for the 20th anniversary of foundation.
Completion of new Development Building HDMJ development site was relocated to new Development Building.
Completion of new clean room in Parlin Site, the U.S. Clean room facilities in Parlin Site, the U.S. were expanded.
Establishment of Taiwan Laboratory Local laboratory was established.
Establishment of Product Stewardship system Global PS (Product Stewardship) Group was established.
Release of HD8900 series Low-temperature curable alkali positive photosensitive PBO was developed.
Relocation of HDMJ Headquarters HDMJ Headquarters was relocated from Koishikawa to Korakuen.
Release of HD3000 series Highly heat-resistant temporary adhesive material was developed.
10th anniversary Ceremony was held for the 10th anniversary of foundation.
Release of HD4100 series Cu redistribution photosensitive polyimide material was developed.
Release of HD8800 series Highly sensitive alkaline positive photosensitive PBO was developed.
Launch of business in the field of packaging Business was expanded to the packaging market in Taiwan.
Relocation of HDMJ Headquarters HDMJ Headquarters was relocated from Shibuya to Koishikawa.
Release of HD8000 series Alkaline positive photosensitive polyimide material was developed.
Commencement of operations of new factory in the U.S. New factory in Parlin Site in New Jersey, the U.S. commenced operations.
Establishment of HDME Hitachi Chemical DuPont MicroSystems GmbH (currently HD MicroSystems GmbH, HDME ) was established in Germany as a 100% subsidiary of Hitachi Chemical DuPont MicroSystems, L.L.C.(HDMA).
Release of HD4000 series High-Tg photosensitive polyimide material for flip chips was developed.
Launch of business on November 1 HDMA and HDMJ started business. Osaka office was opened.
Establishment of HDMJ HDMJ was established in Japan.
Establishment of HDMA The founding parent company, HDMA, was established in the U.S.
Sales of the products taken over from the parent companies started.