---
title: History | Company | HD MicroSystems LLC
description: HD MicroSystems™ is the premier supplier of polyimide and PBO precursor chemistries specifically engineered for microelectronic applications.
image: /hubfs/images23/sns_ogp.jpg
---

Company

# History

- [Top](https://www.hdmicrosystems.com/ja/?hsLang=en)
- Company

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2022

- 6-Oct
  
  25th anniversary Ceremony was held for the 25th anniversary of foundation.
- 1-Apr
  
  Relocation of HDMJ Headquarters![](https://www.hdmicrosystems.com/hubfs/images23/history/img098.jpg) HD MicroSystems, Ltd. (HDMJ) Headquarters was relocated from Iidabashi to Shinjuku.

2021

- -
  
  Release of HD7000 series Low-temperature curable solvent developable photosensitive PI was developed.

2020

- 1-Aug
  
  Change of company name Company name was changed to HD MicroSystems, Ltd.

2017

- -
  
  20th anniversary Ceremony was held for the 20th anniversary of foundation.

2016

- -
  
  Completion of new Development Building![](https://www.hdmicrosystems.com/hubfs/images23/history/img03.jpg) HDMJ development site was relocated to new Development Building.
- -
  
  Completion of new clean room in Parlin Site, the U.S.![](https://www.hdmicrosystems.com/hubfs/images23/history/img04.jpg) Clean room facilities in Parlin Site, the U.S. were expanded.

2015

- -
  
  Establishment of Taiwan Laboratory![](https://www.hdmicrosystems.com/hubfs/images23/history/img010.jpg) Local laboratory was established.

2013

- -
  
  Establishment of Product Stewardship system Global PS (Product Stewardship) Group was established.

2009

- -
  
  Release of HD8900 series Low-temperature curable alkali positive photosensitive PBO was developed.

2008

- -
  
  Relocation of HDMJ Headquarters![](https://www.hdmicrosystems.com/hubfs/images23/history/img05.jpg) HDMJ Headquarters was relocated from Koishikawa to Korakuen.

2007

- -
  
  Release of HD3000 series Highly heat-resistant temporary adhesive material was developed.
- -
  
  10th anniversary Ceremony was held for the 10th anniversary of foundation.

2004

- -
  
  Release of HD4100 series Cu redistribution photosensitive polyimide material was developed.
- -
  
  Release of HD8800 series Highly sensitive alkaline positive photosensitive PBO was developed.
- -
  
  Launch of business in the field of packaging![](https://www.hdmicrosystems.com/hubfs/images23/history/img07.jpg) Business was expanded to the packaging market in Taiwan.

2003

- -
  
   Relocation of HDMJ Headquarters HDMJ Headquarters was relocated from Shibuya to Koishikawa.

2000

- -
  
  Release of HD8000 series Alkaline positive photosensitive polyimide material was developed.

1999

- -
  
  Commencement of operations of new factory in the U.S.![](https://www.hdmicrosystems.com/hubfs/images23/history/img08.jpg) New factory in Parlin Site in New Jersey, the U.S. commenced operations.
- -
  
  Establishment of HDME Hitachi Chemical DuPont MicroSystems GmbH (currently HD MicroSystems GmbH, HDME ) was established in Germany as a 100% subsidiary of Hitachi Chemical DuPont MicroSystems, L.L.C.(HDMA).

1998

- -
  
  Release of HD4000 series High-Tg photosensitive polyimide material for flip chips was developed.

1997

- 1-Nov
  
   Launch of business on November 1 HDMA and HDMJ started business.　Osaka office was opened.
- 7-Aug
  
   Establishment of HDMJ HDMJ was established in Japan.
- 6-Aug
  
   Establishment of HDMA The founding parent company, HDMA, was established in the U.S.  
  Sales of the products taken over from the parent companies started.

 

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Technical support ─

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[![Support base](https://www.hdmicrosystems.com/hubfs/images23/top/support_st_icon.svg)

Locations ─

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Contact ─

](https://www.hdmicrosystems.com/support/contact-us/?hsLang=en)

[HD MicroSystems™ ](https://www.hdmicrosystems.com/?hsLang=en)

- [Top page ](https://www.hdmicrosystems.com/?hsLang=en)
- Products
  
    - [Contact us](https://www.hdmicrosystems.com/support/contact-us/?hsLang=en)
    - [HD4100 series](https://www.hdmicrosystems.com/products/hd4100/?hsLang=en)
    - [HD7110](https://www.hdmicrosystems.com/products/hd7110/?hsLang=en)
    - [HD7204](https://www.hdmicrosystems.com/products/hd7204/?hsLang=en)
    - [HD8820](https://www.hdmicrosystems.com/products/hd8820/?hsLang=en)
    - [HD8930](https://www.hdmicrosystems.com/products/hd8930/?hsLang=en)
    - [HD3000 series](https://www.hdmicrosystems.com/products/hd3000/?hsLang=en)
    - [PIX-1400/PIX-3400 series](https://www.hdmicrosystems.com/products/pix-1400/?hsLang=en)
    - [PI2525](https://www.hdmicrosystems.com/products/pi2525/?hsLang=en)
    - [PI2545](https://www.hdmicrosystems.com/products/pi2545/?hsLang=en)
    - [PI2600 series](https://www.hdmicrosystems.com/products/pi2600/?hsLang=en)
- News
  
    - [information](https://www.hdmicrosystems.com/news/information/?hsLang=en)
    - [Press Release](https://www.hdmicrosystems.com/news/press-releases/?hsLang=en)
- R&D 
  
    - [About Liquid Polyimide](https://www.hdmicrosystems.com/rad/polyimide/?hsLang=en)
    - [Applications](https://www.hdmicrosystems.com/rad/applicability/case01?hsLang=en) 
          - [State-of-the-art Materials for Semiconductors](https://www.hdmicrosystems.com/rad/applicability/case01?hsLang=en)
          - [Environment-friendly Product Development](https://www.hdmicrosystems.com/rad/applicability/case02?hsLang=en)
          - [R&D for Bonding Materials ](https://www.hdmicrosystems.com/rad/applicability/case03?hsLang=en)
          - [Addressing Various Coating Methods](https://www.hdmicrosystems.com/rad/applicability/case04?hsLang=en)
    - [R&D locations](https://www.hdmicrosystems.com/rad/development-base/?hsLang=en)
    - [Conferences](https://www.hdmicrosystems.com/rad/exhibitions/?hsLang=en)
- Company 
  
    - [About us](https://www.hdmicrosystems.com/company/about/?hsLang=en)
    - [Philosophy](https://www.hdmicrosystems.com/company/philosophy/?hsLang=en)
    - [Profile](https://www.hdmicrosystems.com/company/company-profile/?hsLang=en)
    - [Regulatory & compliance](https://www.hdmicrosystems.com/company/product-stewardship/?hsLang=en)
    - [Commitment to quality](https://www.hdmicrosystems.com/company/commitment-to-quality/?hsLang=en)
    - [History](https://www.hdmicrosystems.com/company/history/?hsLang=en)
- Inquire 
  
    - [Contact us](https://www.hdmicrosystems.com/support/contact-us/?hsLang=en)
    - [Conditions of Sale](https://www.hdmicrosystems.com/support/sales/?hsLang=en)
    - [Technical Support](https://www.hdmicrosystems.com/support/technical-support/?hsLang=en)
    - [Locations](https://www.hdmicrosystems.com/support/support-base/?hsLang=en)

[Privacy policy](https://www.hdmicrosystems.com/privacy-policy/?hsLang=en)  
[Legal Notices & Terms of Use](https://www.hdmicrosystems.com/terms_of_use/?hsLang=en)

[Japanese](https://www.hdmicrosystems.com/jp/?hsLang=en)