HD8930 is an NMP-free alkaline-developable positive-tone photosensitive PBO precursor that reduces the NMP content in the product to below the REACH regulation value.
In order to comply with environmental regulations, HD8930 is an NMP-free alkaline-developable positive-tone photosensitive PBO precursor that reduces the NMP content in the product to below the REACH regulation value. It can be cured at low temperatures (200-250°C), and the film after curing exhibits high elongation. It can be used as a packaging material that takes advantage of the high resolution of positive materials.
REACH Compliant NMP Free material
HD8930 is an NMP-free,positive photosensitive PBO precursor that reduces the NMP content in the product to below the regulation value in compliance with the EU's chemical substance regulations.
Low temp curable
Compared to conventional polyimide/PBO, HD8930 can form a cured film at low temperatures. Curing at 200℃ to 250℃ shows good film properties
High Elongation
HD8930 is a low temperature curable product with high elongation.
Achieve high resolution
HD8930 is capable of high resolution patterning. This product is a high resolution product that can form a via pattern of 3μm.
Low temp curable Posi-tone PBO
Redistribution layer
In mobile devices, etc., represented by smartphones and wearables, solder or copper bump bonding technology and multi-layer interconnection technology are utilized to increase packaging density. In this application, our products with high resolution and compatibility with dissimilar materials enable smaller devices and higher reliability. In this field, we have been releasing environment-friendly products that are compatible with even devices with structures or characteristics that limit process temperature, thereby contributing to progress in PKG processes.
