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History

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─

2022

  • 6-Oct

    25th anniversary Ceremony was held for the 25th anniversary of foundation.

  • 1-Apr

    Relocation of HDMJ Headquarters HD MicroSystems, Ltd. (HDMJ) Headquarters was relocated from Iidabashi to Shinjuku.

2021

  • -

    Release of HD7000 series Low-temperature curable solvent developable photosensitive PI was developed.

2020

  • 1-Aug

    Change of company name Company name was changed to HD MicroSystems, Ltd.

2017

  • -

    20th anniversary Ceremony was held for the 20th anniversary of foundation.

2016

  • -

    Completion of new Development Building HDMJ development site was relocated to new Development Building.

  • -

    Completion of new clean room in Parlin Site, the U.S. Clean room facilities in Parlin Site, the U.S. were expanded.

2015

  • -

    Establishment of Taiwan Laboratory Local laboratory was established.

2013

  • -

    Establishment of Product Stewardship system Global PS (Product Stewardship) Group was established.

2009

  • -

    Release of HD8900 series Low-temperature curable alkali positive photosensitive PBO was developed.

2008

  • -

    Relocation of HDMJ Headquarters HDMJ Headquarters was relocated from Koishikawa to Korakuen.

2007

  • -

    Release of HD3000 series Highly heat-resistant temporary adhesive material was developed.

  • -

    10th anniversary Ceremony was held for the 10th anniversary of foundation.

2004

  • -

    Release of HD4100 series Cu redistribution photosensitive polyimide material was developed.

  • -

    Release of HD8800 series Highly sensitive alkaline positive photosensitive PBO was developed.

  • -

    Launch of business in the field of packaging Business was expanded to the packaging market in Taiwan.

2003

  • -

    Relocation of HDMJ Headquarters HDMJ Headquarters was relocated from Shibuya to Koishikawa.

2000

  • -

    Release of HD8000 series Alkaline positive photosensitive polyimide material was developed.

1999

  • -

    Commencement of operations of new factory in the U.S. New factory in Parlin Site in New Jersey, the U.S. commenced operations.

  • -

    Establishment of HDME Hitachi Chemical DuPont MicroSystems GmbH (currently HD MicroSystems GmbH, HDME ) was established in Germany as a 100% subsidiary of Hitachi Chemical DuPont MicroSystems, L.L.C.(HDMA).

1998

  • -

    Release of HD4000 series High-Tg photosensitive polyimide material for flip chips was developed.

1997

  • 1-Nov

    Launch of business on November 1 HDMA and HDMJ started business. Osaka office was opened.

  • 7-Aug

    Establishment of HDMJ HDMJ was established in Japan.

  • 6-Aug

    Establishment of HDMA The founding parent company, HDMA, was established in the U.S.
    Sales of the products taken over from the parent companies started.

 
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      • State-of-the-art Materials for Semiconductors
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      • Addressing Various Coating Methods
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    HD MicroSystems™
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