HD3007 is a non-photodefinable polyimide precursor designed for use as a temporary or permanent adhesive in 3D packaging applications. This material exhibits thermoplastic behavior after cure and during bonding at moderate temperature and pressure. HD3007 has high adhesion to silicon, glass, polyimide and other substrates.
HD3007 has been used as a temporary adhesive bonding wafers to carrier wafers for backgrinding and other processes. Debonding has been demonstrated with laser, solvent and thermal release methods. Residual HD3007 can be removed using a dry etch or solvent process.