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HD3000 series

HD3000series is REACH compliant NMP free non photosensitive polyimide precursor. While maintaining the high heat resistance and high chemical resistance of polyimide, it expresses thermoplasticity. The cured film works as a temporary bonding material between wafers and wafers, between wafers and chips, etc., and can withstand heat treatment at high temperatures and exposure to chemicals. After bonding, it can be easily removed by using laser or solvent.

  1. Features
  2. Product features
  3. Application
  4. SDS data sheet
  5. Related products

HD3000series is REACH compliant NMP free non photosensitive polyimide precursor. While maintaining the high heat resistance and high chemical resistance of polyimide, it expresses thermoplasticity. The cured film works as a temporary bonding material between wafers and wafers, between wafers and chips, etc., and can withstand heat treatment at high temperatures and exposure to chemicals. After bonding, it can be easily removed by using laser or solvent.

Features

HD3000 can be used as a temporary bonding material by thermocompression bonding.

HD3000 series can be bonded to Si substrates and glass substrates by applying heat and pressure after curing, and exhibits excellent bondability.

High heat resistance

HD3000 series has a high heat resistance design to prevent voids after bonding. The cured film shows no weight loss up to 450°C and can be used for high temperature processes after bonding.

Removable with certain solvents

HD3000 series can be removedfrom the substrate with a laser, and polyimide remaining on the coated surface can be removed with a solvent.

REACH Compliant NMP Free material

HD3000 is an NMP-free non-photosensitive polyimide precursor that complies with the EU's chemical substance regulations and reduces the NMP content in the product to below the regulation value.

Product features

High heat resistance temporary bonding material

Photodefineable
non-photosensitive polyimide
Developer
-
Cure temperature
250-350℃
Thickness
3-20 μm
NMP free
NMP free
Resolution (5 µmt)
-
Modulus
3.6 GPa
Elongation
90%
Tensile strength
140 MPa
Tg
188 ℃
CTE
-
Td5
560 ℃
Application
Temporary bonding material

Application

HD3000 seriesの画像

Temporary adhesive

In recent years, the substrates for 2.xD packages, power devices, etc. have been becoming increasingly thinner, necessitating a way of handling and packaging that will not damage such substrates. With high heat resistance and chemical resistance, our polyimide also finds its use in temporary and permanent adhesives to provide various solutions in these applications.

SDS data sheet

化学品の危険有害性、組成および成分情報、取り扱いに関する情報などを記載しております。
アルミニウムおよびアルミニウム合金の圧延品（板、条、管、棒、線、押出形材）全般に関するSDSを通知致します。

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