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HD 3000 series
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HD3000series is REACH compliant NMP free non photosensitive polyimide precursor.
HD3000series is REACH compliant NMP free non photosensitive polyimide precursor. While maintaining the high heat resistance and high chemical resistance of polyimide, it expresses thermoplasticity. The cured film works as a temporary bonding material between wafers and wafers, between wafers and chips, etc., and can withstand heat treatment at high temperatures and exposure to chemicals. After bonding, it can be easily removed by using laser or solvent.
Features
HD3000 can be used as a temporary bonding material by thermocompression bonding.
HD3000 series can be bonded to Si substrates and glass substrates by applying heat and pressure after curing, and exhibits excellent bondability.
High heat resistance
HD3000 series has a high heat resistance design to prevent voids after bonding. The cured film shows no weight loss up to 450°C and can be used for high temperature processes after bonding.
Removable with certain solvents
HD3000 series can be removedfrom the substrate with a laser, and polyimide remaining on the coated surface can be removed with a solvent.
REACH Compliant NMP Free material
HD3000 is an NMP-free non-photosensitive polyimide precursor that complies with the EU's chemical substance regulations and reduces the NMP content in the product to below the regulation value.
Product features
High heat resistance temporary bonding material
- Photodefineable
- non-photosensitive polyimide
- Developer
- -
- Cure temperature
- 250-350℃
- Application
- 3-20 μm
- NMP free
- Y
- Resolution (5 µmt)
- -
- Modulus
- 3.6 GPa
- Elongation
- 90%
- Tensile strength
- 140 MPa
- Tg
- 188 ℃
- CTE
- -
- Td5
- 560 ℃
- Application
- Temporary bonding material
Application
Temporary adhesive
In recent years, the substrates for 2.xD packages, power devices, etc. have been becoming increasingly thinner, necessitating a way of handling and packaging that will not damage such substrates. With high heat resistance and chemical resistance, our polyimide also finds its use in temporary and permanent adhesives to provide various solutions in these applications.
