making it a non-photosensitive polyimide precursor for applications that are difficult to cure at high temperatures such as 350℃.
PI2525 undergoes imidization even at low temperatures, making it a non-photosensitive polyimide precursor for applications that are difficult to cure at high temperatures such as 350℃. It is generally used as a stress buffer and insulating film for semiconductor packages. By pre-treating the substrate with an adhesion agent, it exhibits high adhesion to silicon substrates and metals.
Compatible with wet etching processes
Although PI2525 is a non-photosensitive polyimide, it can be patterned by developing TMAH by using a resist coating material.
Low temp curable
PI2525 can be cured at lower temperatures than other non-photosensitive PIs. Even at low temperatures, the polyimide precursor forms polyimide and exhibits its properties.
Excellent room temperature storage stability
PI2525 shows very good storage stability. Viscosity changes are small when stored at room temperature, and changes in coating film thickness can be suppressed.
Low temp curable non-photosensitive Polyimide
Stress buffer layer
We provide polyimide coating products that satisfy a wide variety of process conditions and physical property requirements and are environment-friendly to cover the circuit boards of various devices ranging from advanced node devices to industrial high-power devices. Our polyimide film, serving as a stress buffer, is approximately 3 to 10 μm thick and protects wiring and inorganic insulating layers from the stress of mounting work and temperature changes to ensure reliability.
