These polyimides are suitable for applications where the high cure temperatures typically used for polyimides (350°C) cause problems. These polyimides imidize faster and at lower temperatures (200°C) than standard polyimide precursors.
Typical applications for these materials are as stress buffer or interlayer dielectric layers over low temperature substrates. They are also effective for fiber optic and quartz capillary coatings on glass drawing lines due to their rapid cure rate.
Note: These materials (except for PI2574) require the use of an adhesion promoter.
Adhesion promoters are required for all non-photodefinable products (except for PI-2574).