Products

PI 2545

PI2545 is a non-photosensitive polyimide precursor that has long been used in microelectronics as a highly heat-resistant coating material.

Features

Compatible with wet etching processes

Although PI2545 is a non-photosensitive polyimide, it can be patterned by developing TMAH by using a resist coating material.

Excellent heat resistance

PI2545 has high heat resistance. It is designed so that the glass transition temperature reaches 400℃ after forming the cured film, making it suitable for high temperature environments.

Low CTE

PI2545 shows a lower coefficient of thermal expansion than general polyimide. It shows 13ppm/℃ under standard condition and suppresses mismatch with inorganic film.

Product features

High heat resistance non-photosensitive polyimide

Photodefineable
non-photosensitive polyimide
Developer
-
Cure temperature
250-375℃
Application
1-3 μm
NMP free
-
Resolution (5 µmt)
-
Modulus
2.3 GPa
Elongation
100%
Tensile strength
260 MPa
Tg
over 400 ℃
CTE
-
Td5
580 ℃
Application
Stress buffer

Application

PI 2545 | Products | HD MicroSystems LLCの画像

Stress buffer layer

We provide polyimide coating products that satisfy a wide variety of process conditions and physical property requirements and are environment-friendly to cover the circuit boards of various devices ranging from advanced node devices to industrial high-power devices. Our polyimide film, serving as a stress buffer, is approximately 3 to 10 μm thick and protects wiring and inorganic insulating layers from the stress of mounting work and temperature changes to ensure reliability.

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