Products

PI 2525

making it a non-photosensitive polyimide precursor for applications that are difficult to cure at high temperatures such as 350℃.

Features

Compatible with wet etching processes

Although PI2525 is a non-photosensitive polyimide, it can be patterned by developing TMAH by using a resist coating material.

Low temp curable

PI2525 can be cured at lower temperatures than other non-photosensitive PIs. Even at low temperatures, the polyimide precursor forms polyimide and exhibits its properties.

Excellent room temperature storage stability

PI2525 shows very good storage stability. Viscosity changes are small when stored at room temperature, and changes in coating film thickness can be suppressed.

Product features

Low temp curable non-photosensitive Polyimide

Photodefineable
non-photosensitive polyimide
Developer
-
Cure temperature
250-350℃
Application
6-12 μm
NMP free
-
Resolution (5 µmt)
-
Modulus
3.3 GPa
Elongation
40%
Tensile strength
130 MPa
Tg
310 ℃
CTE
-
Td5
560 ℃
Application
Stress buffer

Application

PI 2525 | Products | HD MicroSystems LLCの画像

Stress buffer layer

We provide polyimide coating products that satisfy a wide variety of process conditions and physical property requirements and are environment-friendly to cover the circuit boards of various devices ranging from advanced node devices to industrial high-power devices. Our polyimide film, serving as a stress buffer, is approximately 3 to 10 μm thick and protects wiring and inorganic insulating layers from the stress of mounting work and temperature changes to ensure reliability.

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