PI2545 is a non-photosensitive polyimide precursor that has long been used in microelectronics as a highly heat-resistant coating material.
PI2545 is a non-photosensitive polyimide precursor that has long been used in microelectronics as a highly heat-resistant coating material. The cured film exhibits heat resistance of 400℃ or higher. Although this product does not have photosensitivity, it is possible to form patterns using a positive photoresist process using a positive photoresist and an aqueous solution of TMAH.
Compatible with wet etching processes
Although PI2545 is a non-photosensitive polyimide, it can be patterned by developing TMAH by using a resist coating material.
Excellent heat resistance
PI2545 has high heat resistance. It is designed so that the glass transition temperature reaches 400℃ after forming the cured film, making it suitable for high temperature environments.
Low CTE
PI2545 shows a lower coefficient of thermal expansion than general polyimide. It shows 13ppm/℃ under standard condition and suppresses mismatch with inorganic film.
High heat resistance non-photosensitive polyimide
Stress buffer layer
We provide polyimide coating products that satisfy a wide variety of process conditions and physical property requirements and are environment-friendly to cover the circuit boards of various devices ranging from advanced node devices to industrial high-power devices. Our polyimide film, serving as a stress buffer, is approximately 3 to 10 μm thick and protects wiring and inorganic insulating layers from the stress of mounting work and temperature changes to ensure reliability.
