--- title: Conferences | R&D | HD MicroSystems LLC description: HD MicroSystems™ is the premier supplier of polyimide and PBO precursor chemistries specifically engineered for microelectronic applications. image: /hubfs/images23/sns_ogp.jpg --- R&D # Conferences - [Top](https://www.hdmicrosystems.com/?hsLang=en) - R&D ー   | Year | Society name/Journal title | title | Related product | | --- | --- | --- | --- | | 2024 | 2024 IEEE 74th Electronic Components and Technology Conference | High-Planarity, Ultra-Low-Temperature-Curable Photosensitive Polyimide for Heterogeneous Integration | [contact](https://www.dupont.com/electronics-industrial/contact-us.html) | | 2024 | 2024 IEEE 74th Electronic Components and Technology Conference | Enhanced Biased HAST Reliability of Polyimide for High-Density Redistribution Layers | [contact](https://www.dupont.com/electronics-industrial/contact-us.html) | | 2023 | 2023 IEEE 73nd Electronic Components and Technology Conference | Exploring Capabilities of Maskless Lithography for Dual–Image Exposure for FO WLP | [HD8820](https://www.hdmicrosystems.com/products/hd8820?hsLang=en) | | 2022 | 2022 IEEE 72nd Electronic Components and Technology Conference | Development of Polyimide base Photosensitive Permanent Bonding Adhesive for Middle to Low Temperature Hybrid Bonding Processes | [contact](https://www.dupont.com/electronics-industrial/contact-us.html) | | 2022 | 2022 CMC CONFERENCE | Low DF Photosensitive Polyimides for High Speed and High Frequency | [contact](https://www.dupont.com/electronics-industrial/contact-us.html) | | 2021 | 2021 IEEE71st Electronic Components and Technology Conference | A Novel Photosensitive Polyimide Adhesive Materia l for Hybrid Bonding Processing | [contact](https://www.dupont.com/electronics-industrial/contact-us.html) | | 2019 | 52nd International Symposium on Microelectronics | Development of Low Dk and Df polyimides for 5G application | [contact](https://www.dupont.com/electronics-industrial/contact-us.html) | | 2019 | 2019 IEEE 69th Electronic Components and Technolo gy Conference (ECTC2019) | Highly Reliable Photosensitive Negative-tone Poly imide with Low Cure Shrinkage | [HD7204](https://www.hdmicrosystems.com/products/hd7204?hsLang=en) | | 2017 | 2017 International Conference on Electronics Packaging | Recent Progress in Low Temperature Curable Photosensitive Dielectric | [HD8930](https://www.hdmicrosystems.com/products/hd8930?hsLang=en)[HD7110](https://www.hdmicrosystems.com/products/hd7110?hsLang=en)[HD7204](https://www.hdmicrosystems.com/products/hd7204?hsLang=en) | | 2017 | IMAPS 13th International Conference and Exhibition on Device Packaging | Low Temperature Curable PI/PBO for Advanced Packaging | [HD7110](https://www.hdmicrosystems.com/products/hd7110?hsLang=en) | | 2017 | The 14th Annual International Wafer Level Packaging Conference | Low Temperature Curable PI/PBO for Wafer Level Packaging | [HD7110](https://www.hdmicrosystems.com/products/hd7110?hsLang=en) | | 2016 | IEEE CPMT Symposium Japan 2016 | Novel 200 deg. C Curable Positive Tone Poly(benzoxazole) Materials | [contact](https://www.dupont.com/electronics-industrial/contact-us.html) | | 2015 | Journal of Photopolymer Science and Technology 28(2), 215-218, 2015 | Low Stress, High Modulus, Photosensitive Polyimide | [contact](https://www.dupont.com/electronics-industrial/contact-us.html) | | 2014 | The 16th Symposium on Polymers for Microelectronics | Improvement in Adhesion Strength of Positive-tone Photo-definable Poly(benzoxazole) Materials | [HD8930](https://www.hdmicrosystems.com/products/hd8930?hsLang=en) | | 2012 | IEEE CPMT Symposium Japan 2012 | Development of Low CHE, Negative-tone, Photo-definable Polyimide for HDD Suspension | [contact](https://www.dupont.com/electronics-industrial/contact-us.html) | | 2012 | Journal of Microelectronics and Electronic Packaging, 7, 214-219, 2012 | Using permanent and temporary polyimide adhesives in 3D-TSV processing to avoid thin wafer handling | [contact](https://www.dupont.com/electronics-industrial/contact-us.html) | | 2012 | The 15th Symposium on Polymers for Microelectronics | Development of A Photosensitive PBO with Improved Chemical Resistance | [contact](https://www.dupont.com/electronics-industrial/contact-us.html) | | 2010 | Journal of Photopolymer Science and Technology, 23(4), 477, 2012 | Improvement in Chemical Resistance of Positive-tone Photodefinable Poly(benzoxazole) Materials | [HD8820](https://www.hdmicrosystems.com/products/hd8820?hsLang=en) | | 2010 | The 14th Symposium on Polymers for Microelectronics | Ultra Low Temperature Curable Positive-tone Photodefinable Poly(benzoxazole)-II | [HD8930](https://www.hdmicrosystems.com/products/hd8930?hsLang=en) | [![Technical support](https://www.hdmicrosystems.com/hubfs/images23/top/support_tech_icon.svg) Technical support ─ ](https://www.hdmicrosystems.com/support/technical-support/?hsLang=en) [![Support base](https://www.hdmicrosystems.com/hubfs/images23/top/support_st_icon.svg) Locations ─ ](https://www.hdmicrosystems.com/support/support-base/?hsLang=en) [![Contact](https://www.hdmicrosystems.com/hubfs/images23/top/support_ct_icon.svg) Contact ─ ](https://www.hdmicrosystems.com/support/contact-us/?hsLang=en) [HD MicroSystems™ ](https://www.hdmicrosystems.com/?hsLang=en) - 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