Year |
Society name/Journal title |
title |
Related product |
2024 |
2024 IEEE 74th Electronic Components and Technology Conference |
Enhanced Biased HAST Reliability of Polyimide for High-Density Redistribution Layers |
contact
|
2024 |
2024 IEEE 74th Electronic Components and Technology Conference |
High-Planarity, Ultra-Low-Temperature-Curable Photosensitive Polyimide for Heterogeneous Integration |
contact
|
2023 |
2023 IEEE 73nd Electronic Components and Technology Conference |
Exploring Capabilities of Maskless Lithography for Dual–Image Exposure for FO WLP |
HD 8961HD 8820
|
2022 |
2022 IEEE 72nd Electronic Components and Technology Conference |
Development of Polyimide base Photosensitive Permanent Bonding Adhesive for Middle to Low Temperature Hybrid Bonding Processes |
contact
|
2022 |
2022 CMC CONFERENCE |
Low DF Photosensitive Polyimides for High Speed and High Frequency |
contact
|
2021 |
2021 IEEE71st Electronic Components and Technology Conference |
A Novel Photosensitive Polyimide Adhesive Materia l for Hybrid Bonding Processing |
contact
|
2019 |
52nd International Symposium on Microelectronics |
Development of Low Dk and Df polyimides for 5G application |
contact
|
2019 |
2019 IEEE 69th Electronic Components and Technolo gy Conference (ECTC2019)" |
"Highly Reliable Photosensitive Negative-tone Poly imide with Low Cure Shrinkage" |
contact
|
2017 |
2017 International Conference on Electronics Packaging |
Recent Progress in Low Temperature Curable Photosensitive Dielectric |
HD 8961HD 7110HD 8930
|
2017 |
IMAPS 13th International Conference and Exhibition on Device Packaging |
Low Temperature Curable PI/PBO for Advanced Packaging |
HD 8961HD 7110
|
2017 |
The 14th Annual International Wafer Level Packaging Conference |
Low Temperature Curable PI/PBO for Wafer Level Packaging |
HD 8961HD 7110
|
2016 |
IEEE CPMT Symposium Japan 2016 |
Novel 200 deg. C Curable Positive Tone Poly(benzoxazole) Materials |
HD 8961
|
2015 |
Journal of Photopolymer Science and Technology 28(2), 215-218, 2015 |
Low Stress, High Modulus, Photosensitive Polyimide |
contact
|
2014 |
The 16th Symposium on Polymers for Microelectronics |
Improvement in Adhesion Strength of Positive-tone Photo-definable Poly(benzoxazole) Materials |
HD 8930
|
2012 |
IEEE CPMT Symposium Japan 2012 |
Development of Low CHE, Negative-tone, Photo-definable Polyimide for HDD Suspension |
contact
|
2012 |
Journal of Microelectronics and Electronic Packaging, 7, 214-219, 2012 |
Using permanent and temporary polyimide adhesives in 3D-TSV processing to avoid thin wafer handling |
contact
|
2012 |
The 15th Symposium on Polymers for Microelectronics |
Development of A Photosensitive PBO with Improved Chemical Resistance |
contact
|
2010 |
Journal of Photopolymer Science and Technology, 23(4), 477, 2012 |
Improvement in Chemical Resistance of Positive-tone Photodefinable Poly(benzoxazole) Materials |
HD 8820
|
2010 |
The 14th Symposium on Polymers for Microelectronics |
Ultra Low Temperature Curable Positive-tone Photodefinable Poly(benzoxazole)-II |
HD 8930
|