---
title: 2024 IEEE 74th Electronic Components and Technology Conference
description: 2024 IEEE 74th Electronic Components and Technology Conference
image: /hubfs/images23/sns_ogp.jpg
---

2024/05/27  Information

# 2024 IEEE 74th Electronic Components and Technology Conference

ECTC 2024 will be held on May 28-31, Denver, Colorado, USA.

HDMicroSystems will have our booth and two technical presentations about advanced packaging material.

 Date : May28 – 31, 2024

Location : Gaylord Rockies Resort & Convention Center, Denver, Colorado, USA

 Information of booth

Booth number : 600/602

 Information of presentations

<Presentation 1>

Presentation date : May29 9:30-12:35

Session title : 4 Reliability of Advanced Substrates and Interconnects

Room : Summit 8-9

Presentation title : 2. Enhanced Biased HAST Reliability of Polyimide for High-Density Redistribution Layers

 <Presentation 2>

Presentation date : May31 14:00-17:05

Session title : 33 Fine-Pitch Materials and Processes

Room : Crest 3-5

Presentation title : 7. High-Planarity, Ultra-Low-Temperature-Curable Photosensitive Polyimide for Heterogeneous Integration

We look forward to your visit.

![ECTC2024-HDMS](https://www.hdmicrosystems.com/hs-fs/hubfs/News-information/ECTC2024-HDMS.png?width=1224&height=723&name=ECTC2024-HDMS.png)

 

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