ECTC 2024 will be held on May 28-31, Denver, Colorado, USA.
HDMicroSystems will have our booth and two technical presentations about advanced packaging material.
Date : May28 – 31, 2024
Location : Gaylord Rockies Resort & Convention Center, Denver, Colorado, USA
Information of booth
Booth number : 600/602
Information of presentations
<Presentation 1>
Presentation date : May29 9:30-12:35
Session title : 4 Reliability of Advanced Substrates and Interconnects
Room : Summit 8-9
Presentation title : 2. Enhanced Biased HAST Reliability of Polyimide for High-Density Redistribution Layers
<Presentation 2>
Presentation date : May31 14:00-17:05
Session title : 33 Fine-Pitch Materials and Processes
Room : Crest 3-5
Presentation title : 7. High-Planarity, Ultra-Low-Temperature-Curable Photosensitive Polyimide for Heterogeneous Integration
We look forward to your visit.
