The PI2600 series is a non-photosensitive polyimide precursor that forms a resin film with a high modulus and low coefficient of linear thermal expansion (CTE) to form a very rigid polyimide after curing.
The PI2600 series is a non-photosensitive polyimide precursor that forms a resin film with a high modulus and low coefficient of linear thermal expansion (CTE) to form a very rigid polyimide after curing. Therefore, it is possible to reduce wafer stress after curing. Patterning can be done by dry etching or laser ablation.
Compatible with dry etching process
Although the PI2600 series is a non-photosensitive polyimide, it can be patterned by dry etching or laser ablation using a resist coat material.
Low coefficient of linear thermal expansion (CTE) close to inorganic films
PI2600 series shows an extremely low coefficient of thermal expansion compared to general polyimide. It shows a thermal expansion coefficient of 5-9ppm/°C under standard conditions, which is equivalent to that of an inorganic film.
PI2600 series is a polyimide that incorporates an extremely rigid structure, and shows an modulus of 7.0-9.4 GPa when formed under standard conditions.
High heat resistance
PI2600 serie has high heat resistance. It is designed so that the glass transition temperature reaches 380℃ after forming the cured film, making it suitable for high temperature environments.
ultra low stress non-Photosensitive Polyimide
Resolution (5 µmt)
Stress buffer layer
We provide polyimide coating products that satisfy a wide variety of process conditions and physical property requirements and are environment-friendly to cover the circuit boards of various devices ranging from advanced node devices to industrial high-power devices. Our polyimide film, serving as a stress buffer, is approximately 3 to 10 μm thick and protects wiring and inorganic insulating layers from the stress of mounting work and temperature changes to ensure reliability.