| 日付 | 学会名/雑誌名 | 論文タイトル | 関連製品 |
|---|---|---|---|
| 2024 | 2024 IEEE 74th Electronic Components and Technology Conference | High-Planarity, Ultra-Low-Temperature-Curable Photosensitive Polyimide for Heterogeneous Integration | お問い合わせ |
| 2024 | 2024 IEEE 74th Electronic Components and Technology Conference | Enhanced Biased HAST Reliability of Polyimide for High-Density Redistribution Layers | お問い合わせ |
| 2023 | 2023 IEEE 73nd Electronic Components and Technology Conference | Exploring Capabilities of Maskless Lithography for Dual–Image Exposure for FO WLP | HD8820 |
| 2022 | 2022 IEEE 72nd Electronic Components and Technology Conference | Development of Polyimide base Photosensitive Permanent Bonding Adhesive for Middle to Low Temperature Hybrid Bonding Processes | お問い合わせ |
| 2022 | 2022 CMC CONFERENCE | Low DF Photosensitive Polyimides for High Speed and High Frequency | お問い合わせ |
| 2021 | 2021 IEEE71st Electronic Components and Technology Conference | A Novel Photosensitive Polyimide Adhesive Materia l for Hybrid Bonding Processing | お問い合わせ |
| 2019 | 52nd International Symposium on Microelectronics | Development of Low Dk and Df polyimides for 5G application | お問い合わせ |
| 2019 | 2019 IEEE 69th Electronic Components and Technolo gy Conference (ECTC2019) | Highly Reliable Photosensitive Negative-tone Poly imide with Low Cure Shrinkage | お問い合わせ |
| 2017 | 2017 International Conference on Electronics Packaging | Recent Progress in Low Temperature Curable Photosensitive Dielectric | HD8930HD7110 |
| 2017 | IMAPS 13th International Conference and Exhibition on Device Packaging | Low Temperature Curable PI/PBO for Advanced Packaging | HD7110 |
| 2017 | The 14th Annual International Wafer Level Packaging Conference | Low Temperature Curable PI/PBO for Wafer Level Packaging | HD7110 |
| 2017 | 第27回マイクロエレクトロニクスシンポジウム(MES2017)秋季大会 | 低温硬化ポジ型感光性樹脂の高溶解コントラスト化 | お問い合わせ |
| 2016 | IEEE CPMT Symposium Japan 2016 | Novel 200 deg. C Curable Positive Tone Poly(benzoxazole) Materials | お問い合わせ |
| 2015 | Journal of Photopolymer Science and Technology 28(2), 215-218, 2015 | Low Stress, High Modulus, Photosensitive Polyimide | お問い合わせ |
| 2014 | The 16th Symposium on Polymers for Microelectronics | Improvement in Adhesion Strength of Positive-tone Photo-definable Poly(benzoxazole) Materials | HD8930 |
| 2012 | IEEE CPMT Symposium Japan 2012 | Development of Low CHE, Negative-tone, Photo-definable Polyimide for HDD Suspension | お問い合わせ |
| 2012 | Journal of Microelectronics and Electronic Packaging, 7, 214-219, 2012 | Journal of Microelectronics and Electronic Packaging, 7, 214-219, 2012Using permanent and temporary polyimide adhesives in 3D-TSV processing to avoid thin wafer handling | お問い合わせ |
| 2012 | The 15th Symposium on Polymers for Microelectronics | Development of A Photosensitive PBO with Improved Chemical Resistance | HD8820 |
| 2012 | 日本ゴム協会誌 85(2), 40-45, 2012 | 半導体用ストレスバッファー材料の最新動向 | HD8930 |
| 2010 | Journal of Photopolymer Science and Technology, 23(4), 477, 2012 | Improvement in Chemical Resistance of Positive-tone Photodefinable Poly(benzoxazole) Materials | お問い合わせ |
| 2010 | The 14th Symposium on Polymers for Microelectronics | Ultra Low Temperature Curable Positive-tone Photodefinable Poly(benzoxazole)-II | お問い合わせ |
| 2010 | 電子情報通信学会誌C Vol. J95-C, No. 11, 477-482, 2010 | 三次元パッケージ技術を施行した高耐熱ポリイミド接着剤と薄ウェーハハンドリングへの適用 | お問い合わせ |
