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Keyword
HD 4100 series
High Reliability Nega-tone Polyimide
HD4100 series are solvent developable Nega-tone type Polyimide precursor.
HD 7110
High Reliability Low temp curable Nega-tone Polyimide
HD7110 is a wide range temperature curable and solvent developable Nega-tone type Polyimide precursor.
HD 7204
REACH Compliant NMP Free Nega-tone Polyimide
HD7204 is an NMP-free solvent-developable negative photosensitive polyimide precursor that reduces the NMP content in the product to below the REACH regulation value in order to comply with environmental regulations.
HD 8820
High reliability Posi-tone PBO
HD8820 is an alkaline-developable Posi-tone PBO precursor.
HD 8930
Low temp curable Posi-tone PBO
HD8930 is an NMP-free alkaline-developable positive-tone photosensitive PBO precursor that reduces the NMP content in the product to below the REACH regulation value.
HD 8961
HD8961 is an NMP-free alkaline-developable positive-tone photosensitive PBO precursor that reduces the NMP content in the product to below the REACH regulation value.
HD 3000 series
High heat resistance temporary bonding material
HD3000series is REACH compliant NMP free non photosensitive polyimide precursor.
PIX-1400/PIX-3400 series
Self-adhesive non-photosensitive polyimide
PIX-1400/3400 are non-photosensitive polyimide precursors with self-adhesive properties to SiN, SiON, and SiOx.
PI 2525
Low temp curable non-photosensitive Polyimide
making it a non-photosensitive polyimide precursor for applications that are difficult to cure at high temperatures such as 350℃.
PI 2545
High heat resistance non-photosensitive polyimide
PI2545 is a non-photosensitive polyimide precursor that has long been used in microelectronics as a highly heat-resistant coating material.
PI 2600 series
ultra low stress non-Photosensitive Polyimide
The PI2600 series is a non-photosensitive polyimide precursor that forms a resin film with a high modulus and low coefficient of linear thermal expansion (CTE) to form a very rigid polyimide after curing.
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