HD7110 is a wide range temperature curable and solvent developable Nega-tone type Polyimide precursor.
HD7110 is a wide range temperature curable, solvent developable, Nega-tone type polyimide precursor. This product was developed directly from industrial standard HD4100series. Low temperature curing is effective in reducing wafer stress and warpage. HD7110 achieves high flatness, high insulation reliability, and high resolution and is effective for forming high-density design used in advanced packages. It can also be used for general stress buffer applications.
Achieves high flatness for multi-layer
HD7110 is a product with higher embedded flatness than conventional polyimide products. It achieves high surface flatness when forming multilayer or when there is a substrate structure.
High insulation reliability
HD7110 shows high insulation reliability after curing. It can be used as an insulating film for high-density IC Package design and can maintain its resistance value even after conducting a bias-HAST test at L/S 2μm/2μm for 168 hours.
Achieves high resolution
The HD7110 is capable of high resolution patterning. This product is a high resolution product that can form a via pattern of 5μm.
Maintains high copper adhesion in reliability tests
HD7110 shows high adhesion to copper substrates. This product coated and cured on Cu does not delaminate from copper even after accelerated reliability tests such as PCT condition.
High Reliability Low temp curable Nega-tone Polyimide
Redistribution layer
In mobile devices, etc., represented by smartphones and wearables, solder or copper bump bonding technology and multi-layer interconnection technology are utilized to increase packaging density. In this application, our products with high resolution and compatibility with dissimilar materials enable smaller devices and higher reliability. In this field, we have been releasing environment-friendly products that are compatible with even devices with structures or characteristics that limit process temperature, thereby contributing to progress in PKG processes.
