| Year | Society name/Journal title | title | Related product |
|---|---|---|---|
| 2023 | Exploring Capabilities of Maskless Lithography for Dual–Image Exposure for FO WLP | 2023 IEEE 73nd Electronic Components and Technology Conference | HD 8961HD 8820 |
| 2022 | Development of Polyimide base Photosensitive Permanent Bonding Adhesive for Middle to Low Temperature Hybrid Bonding Processes | 2022 IEEE 72nd Electronic Components and Technology Conference | contact |
| 2022 | Low DF Photosensitive Polyimides for High Speed and High Frequency | 2022 CMC CONFERENCE | contact |
| 2021 | A Novel Photosensitive Polyimide Adhesive Materia l for Hybrid Bonding Processing | 2021 IEEE71st Electronic Components and Technology Conference | contact |
| 2019 | Development of Low Dk and Df polyimides for 5G application | 52nd International Symposium on Microelectronics | contact |
| 2019 | "Highly Reliable Photosensitive Negative-tone Poly imide with Low Cure Shrinkage" | 2019 IEEE 69th Electronic Components and Technolo gy Conference (ECTC2019)" | contact |
| 2017 | Recent Progress in Low Temperature Curable Photosensitive Dielectric | 2017 International Conference on Electronics Packaging | HD 8961HD 7110HD 8930 |
| 2017 | Low Temperature Curable PI/PBO for Advanced Packaging | IMAPS 13th International Conference and Exhibition on Device Packaging | HD 8961HD 7110 |
| 2017 | Low Temperature Curable PI/PBO for Wafer Level Packaging | The 14th Annual International Wafer Level Packaging Conference | HD 8961HD 7110 |
| 2016 | Novel 200 deg. C Curable Positive Tone Poly(benzoxazole) Materials | IEEE CPMT Symposium Japan 2016 | HD 8961 |
| 2015 | Low Stress, High Modulus, Photosensitive Polyimide | Journal of Photopolymer Science and Technology 28(2), 215-218, 2015 | contact |
| 2014 | Improvement in Adhesion Strength of Positive-tone Photo-definable Poly(benzoxazole) Materials | The 16th Symposium on Polymers for Microelectronics | HD 8930 |
| 2012 | Development of Low CHE, Negative-tone, Photo-definable Polyimide for HDD Suspension | IEEE CPMT Symposium Japan 2012 | contact |
| 2012 | Using permanent and temporary polyimide adhesives in 3D-TSV processing to avoid thin wafer handling | Journal of Microelectronics and Electronic Packaging, 7, 214-219, 2012 | contact |
| 2012 | Development of A Photosensitive PBO with Improved Chemical Resistance | The 15th Symposium on Polymers for Microelectronics | contact |
| 2010 | Improvement in Chemical Resistance of Positive-tone Photodefinable Poly(benzoxazole) Materials | Journal of Photopolymer Science and Technology, 23(4), 477, 2012 | HD 8820 |
| 2010 | Ultra Low Temperature Curable Positive-tone Photodefinable Poly(benzoxazole)-II | The 14th Symposium on Polymers for Microelectronics | HD 8930 |
