HD4100 series are solvent developable Nega-tone type Polyimide precursor. HD4100 series show excellent mechanical and thermal film properties and chemical resistance in process. Also HD4100 series have good adhesion to underfill and metal. This series widely applied stress buffer and IC-Package.

In order to comply with environmental regulations, HD8930 is an NMP-free alkaline-developable positive-tone photosensitive PBO precursor that reduces the NMP content in the product to below the REACH regulation value. It can be cured at low temperatures (200-250°C), and the film after curing exhibits high elongation. It can be used as a packaging material that takes advantage of the high resolution of positive materials.

HD7110 is a wide range temperature curable, solvent developable, Nega-tone type polyimide precursor. This product was developed directly from industrial standard HD4100series. Low temperature curing is effective in reducing wafer stress and warpage. HD7110 achieves high flatness, high insulation reliability, and high resolution and is effective for forming high-density design used in advanced packages. It can also be used for general stress buffer applications.

In order to comply with environmental regulations, HD8961 is an NMP-free alkaline-developable positive-tone photosensitive PBO precursor that reduces the NMP content in the product to below the REACH regulation value. Same as HD8930, it can be cured at low temperatures (200-250°C), and the cured film shows high adhesion to copper and is highly resistant to the chemicals used in the semiconductor manufacturing process. It can be used as a packaging material that takes advantage of the high resolution of positive materials.