HD8961 is an NMP-free alkaline-developable positive-tone photosensitive PBO precursor that reduces the NMP content in the product to below the REACH regulation value.
In order to comply with environmental regulations, HD8961 is an NMP-free alkaline-developable positive-tone photosensitive PBO precursor that reduces the NMP content in the product to below the REACH regulation value. Same as HD8930, it can be cured at low temperatures (200-250°C), and the cured film shows high adhesion to copper and is highly resistant to the chemicals used in the semiconductor manufacturing process. It can be used as a packaging material that takes advantage of the high resolution of positive materials.
REACH Compliant NMP Free material
HD8961 is an NMP-free,positive photosensitive PBO precursor that reduces the NMP content in the product to below the regulation value in compliance with the EU's chemical substance regulations.
Low temp curable
Compared to conventional polyimide/PBO, HD8961 can form a cured film at low temperatures. Curing at 200℃ to 250℃ shows good film properties
Excellent Chemical resistance in process
The cured film of HD8961 is highly resistant to chemicals used in the process. The film withstands the process even if it comes into contact with chemicals such as organic solvents, resist strippers, and rinse solutions.
Achieve high resolution
HD8961 is capable of high resolution patterning. This product is a high resolution product that can form a via pattern of 2μm.
Low temp curable Posi-tone PBO
Redistribution layer
In mobile devices, etc., represented by smartphones and wearables, solder or copper bump bonding technology and multi-layer interconnection technology are utilized to increase packaging density. In this application, our products with high resolution and compatibility with dissimilar materials enable smaller devices and higher reliability. In this field, we have been releasing environment-friendly products that are compatible with even devices with structures or characteristics that limit process temperature, thereby contributing to progress in PKG processes.
