PIX-1400/3400 are non-photosensitive polyimide precursors with self-adhesive properties to SiN, SiON, and SiOx.
PIX-1400/3400 are non-photosensitive polyimide precursors with self-adhesive properties to SiN, SiON, and SiOx. PIX series can protect the passivation layer and metal layer by applying it on the IC chip surface. This product does not have photosensitivity, it is possible to form patterns using a positive photoresist process using a positive photoresist and an aqueous solution of TMAH.
Standard non-photosensitive polyimide
PIX-1400/3400 is a standard material used as a non-photosensitive polyimide that is self-adhesive and capable of wet etching.
Non-photosensitive material with self-adhesive properties
PIX-1400/3400 shows high adhesion to Si, SiO2, SiN, and Al, and maintains strong adhesion strength even after accelerated testing.
A wide range of products for a wide range of film thicknesses
PIX-1400/3400 are available in different viscosities and can handle a wide range of film thicknesses according to customer requests. It is possible to form a film thickness of 1.5 μm to 15 μm.
Compatible with wet etching processes
PIX-1400/3400 is a non-photosensitive polyimide, it can be patterned by developing TMAH by using a resist coating material.
Self-adhesive non-photosensitive polyimide
Stress buffer layer
We provide polyimide coating products that satisfy a wide variety of process conditions and physical property requirements and are environment-friendly to cover the circuit boards of various devices ranging from advanced node devices to industrial high-power devices. Our polyimide film, serving as a stress buffer, is approximately 3 to 10 μm thick and protects wiring and inorganic insulating layers from the stress of mounting work and temperature changes to ensure reliability.
